Products
- Double-Sided PCB[43]
- Multilayer PCB[52]
- FPC[1]
- Single-Sided PCB[1]
- Rigid PCB[2]
- Alternative Energy Generators[3]
Contact Us
- Contact Person : Ms. Yuan Evelyn
- Company Name : Shenzhen Xi Ya Nuo Technology Co., Ltd.
- Tel : 0086-2790-8512
- Fax : 0086-2790-7265
- Address : Guangdong,Shenzhen,Haosi village,shajing Town,West Industrial Area,Shenzhen,China
- Country/Region : China
- Zip : 518000
PCB board/FPC board/Printed circuit board/PCB assembly/PCB design /Copy of PCB/ 4 layers board
Product Detailed
Related Categories:Rigid PCB
Detailed Product Description
| 3 layer /printed circuit board /PCB assembly | ||
| info. | Layer: | 3 |
| Material: | FR-4 | |
| Board finished thickness: | 1.6mm | |
| Surface finish/treatment: | OSP | |
| Certification: | UL,ISO9001 | |
| Solder marsk colour: | green | |
| Min. | Min.drilled hole size: | 0.3mm |
| Min.line width: | 6mm | |
| Min.line spacing: | 6mm | |
| Packing | Inner :Vacuum packing/Plastic bag | |
| Outer :Standard carton packing | ||
| Our PCB Production line Capability for your referrence | ||
| 1) | Layer: | from 1 to 28 |
| 2) | Board finished thickness: | 0.21mm-7.0mm |
| 3) | Material: | FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free ,Rogers, HF,NELCON,TACONIC,ARLON,etc |
| 4) | Surface finish/treatment: | HASL/HASL lead free,HAL,Chemical Gold/tin,Immersion Silver/Gold/Tin,OSP, Gold plating,Hard&Soft gold,Plating tin, |
| 5) | Product range: | Flex-PCB,Rigid-PCB,Flex-rigid PCB,HDI PCB ,PCB of single, Double and Multi-layers,High frequency PCB ,etc |
| 6) | Max. finished board size: | 23*25mil(580mm*900mm) |
| 7) | Min.drilled hole size: | 3mil(0.075mm) |
| 8) | Min.line width: | 3mil(0.075mm) |
| 9) | Min.line spacing: | 3mil(0.075mm) |
| 10) | Solder mask color : | Green/yellow/black/white/red/blue |
| 11) | Copper thickness in hole: | >25.0um (1mil) |
| 12) | Shape tolerance: | plus or minus 0.13 |
| 13) | Hole tolerance: | PTH:plus or minus 0.076 NPTH:plus or minus 0.05 |
| 14) | Certificate: | UL,ISO9001,ISO14001,SGS,RoHS compliance |
| 15) | Specail req. | Buried and blind vias+controlled impedence+BGA |
| 16) | Profiling : | Punching ,Routing ,V-CUT,Beveling |
| 17) | Packing | Inner :Vacuum packing/Plastic bag |
| Outer :Standard carton packing | ||
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